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The millimeter wave technology market is expected to grow from USD 3.0 billion in 2024 to USD 7.6 billion by 2029, at a compound annual growth rate (CAGR) of 20.1% during the forecast period.The key players Axxcss Wireless Solutions (US), NEC Corporation (Japan), Ceragon (Isarel), L3Harris Technologies, Inc. (US), Aviat Networks (US), Smiths Group plc (UK), Eravant (US), Farran (Ireland), Keysight Technologies (US), Ducommun Incorporated (US), and Millimeter Wave Product, Inc, (US).
The Digital Signal Processor market is expected to grow from USD 10.1 billion in 2024 to USD 14.7 billion by 2029, at a compound annual growth rate (CAGR) of 7.8% during the forecast period.The key players Analog Devices, Inc. (US), Microchip Technology Inc. (US), Texas Instruments Incorporated (US), NXP Semiconductors (Netherlands), Marvell (US), Qualcomm Technologies, Inc. (US), Cirrus Logic, Inc. (US), STMicroelectronics (Switzerland), TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION (Japan), Infineon Technologies AG (Germany), and Broadcom (US) among others.
The global sustainable manufacturing market size is expected to grow from USD 215.4 billion in 2024 to USD 367.2 billion by 2029, at a compound annual growth rate (CAGR) of 11.3% during the forecast period.The key players Veolia (France), Umicore (Belgium), Braskem (Brazil), Cirba Solutions (US), and NatureWorks (US).
The SiC-on-insulator (SiCOI) film market is expected to grow from USD 37 million in 2024 to USD 1,134 million by 2029, at a compound annual growth rate (CAGR) of 98.1% during the forecast period.The key players SOITEC (France), SICOXS CORPORATION (Japan), NGK INSULATORS, LTD. (Japan), iSABers Materials (China), MTI Corporation (US).
The optical transceiver market is expected to grow from USD 13.6 billion in 2024 to USD 25.0 billion by 2029, at a compound annual growth rate (CAGR) of 13.0% during the forecast period. The key players Coherent Corp. (US), INNOLIGHT (China), Accelink Technology Co. Ltd. (China), Cisco Systems, Inc. (US), Hisense Broadband, Inc. (China), Lumentum Operations LLC (US), Sumitomo Electric Industries, Ltd. (Japan), Broadcom Inc. (US), Fujitsu Optical Components Limited (Japan), and Intel Corporation (US).
The semiconductor intellectual property (IP) market is expected to grow from USD 7.5 billion in 2024 to USD 11.2 billion by 2029, at a compound annual growth rate (CAGR) of 8.5% during the forecast period.The key players Arm Limited (UK), Synopsys, Inc. (US), Cadence Design Systems, Inc. (US), Imagination Technologies (UK), CEVA, Inc. (US), Lattice Semiconductor (US), Rambus (US), eMemory Technology Inc. (Taiwan), Silicon Storage Technology, Inc. (US), VeriSilicon (China), Achronix Semiconductor Corporation (US), ALPHAWAVE SEMI (UK), Analog Bits (US), ARTERIS, INC (US), Frontgrade Gaisler (Sweden).
The global interposer and FOWLP market size is expected to grow from USD 35.6 billion in 2024 to USD 63.5 billion by 2029, at a compound annual growth rate (CAGR) of 12.3% during the forecast period.The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea).
The SiC-On-Insulator and Other Substrates Market size is expected to grow from USD 99 million in 2024 to USD 149 million by 2029, at a compound annual growth rate (CAGR) of 8.5% during the forecast period.The key players Wolfspeed, Inc. (US), SICC Co., Ltd. (China), SOITEC (France), Coherent Corp. (US), GlobalWafers Co., Ltd. (Taiwan), Ceramicforum Co., Ltd. (Tokyo), Xiamen Powerway Advanced Material Co., Ltd. (China), Homray Material Technology (China), Shanghai Zhongyingrong innovative Material Technology Co., Ltd (China), Precision Micro-optics Inc. (US), Tankeblue Semiconductor Co., Ltd. (China), and Hebei Synlight Crystal Co., Ltd. (China).
According to MarketsandMarkets, the spin on carbon market is projected to reach USD 747 million by 2028, registering a CAGR of 30.2% during the forecast period. Key players in the spin on carbon market include Samsung SDI Co., Ltd. (South Korea), Merck KGaA (Germany), Shin-Etsu Chemical Co., Ltd. (Japan), YCCHEM Co., Ltd. (South Korea), Brewer Science, Inc. (US), JSR Micro, Inc. (US), KOYJ Co., Ltd. (South Korea), Irresistible Materials Ltd (UK), Nano-C (US), and DNF Co., Ltd. (South Korea) among others.
The ALD Equipment Market is expected to grow from USD 3.9 billion in 2023 to USD 6.2 billion by 2028, at a compound annual growth rate (CAGR) of 10.0%during the forecast period.The Key Players ASM International N.V. (Netherlands), Tokyo Electron Limited. (Japan), Applied Materials, Inc. (US), LAM RESEARCH CORPORATION. (US), Veeco Instruments Inc. (US), Kurt J. Lesker Company (US), OPTORUN Co., Ltd. (Japan), CVD Equipment Corporation (US), EUGENE TECHNOLOGY CO. LTD. (South Korea), and Beneq (Finland).
The wafer cleaning equipment market is expected to grow from USD 10.1 billion in 2023 to USD 16.5 billion by 2028, at a compound annual growth rate (CAGR) of 10.4% during the forecast period.The Key Players SCREEN Holdings Co., Ltd. (Japan), Tokyo Electron Limited (Japan), Applied Materials (US), LAM Research Corporation (US), Shibaura Mechatronics Corporation (Japan), PVA TePLA AG (Germany), Entregris Inc., (US), SEMES (US), Modutek.com (Japan), Veeco Instruments Inc. (US), Toho Technology (US), ULTRON SYSTEMS, INC. (US), Akrion Technologies (US), Axus Technology (US), SHIBAURA MECHATRONICS CORPORATION (Japan).
The global RF gallium nitride market is expected to grow from USD 1.3 billion in 2022 to USD 2.8 billion by 2028, at a compound annual growth rate (CAGR) of 12.9% during the forecast period.The key players Sumitomo Electric Device Innovations, Inc. (Japan), Qorvo, Inc. (US), WOLFSPEED, INC. (US), NXP Semiconductors (Netherlands), MACOM (US).
The next-generation solar cell market size is expected to grow from USD 3.0 billion in 2023 to USD 7.4 billion by 2028, at a compound annual growth rate (CAGR) of 19.5% during the forecast period.The Key Players First Solar (US), Hanwha Q CELLS (South Korea), Ascent Solar Technologies (US), Oxford PV (UK), Kaneka Solar Energy (Japan), Flisom (Switzerland), Solactron (US), Mitsubishi Chemical Group (Japan), MiaSole (US), and Hanergy thin film power group (China)
The quantum photonics market is expected to grow from USD 0.4 billion in 2023 to USD 3.3 billion by 2030, at a compound annual growth rate (CAGR) of 32.2% during the forecast period.The Major Players Toshiba (Japan), Xanadu (Canada), Quandela (France), ID Quantique (Switzerland), ORCA Computing (UK), and PsiQuantum (US).
The global electronic design automation market is expected to grow from USD 14.5 billion in 2022 to USD 26.2 billion by 2028, at a compound annual growth rate (CAGR) of 9.8% during the forecast period.The Key players such as Cadence Design Systems, Inc. (US), Synopsys, Inc. (US), Siemens (Germany), ANSYS, Inc. (US), Keysight Technologies, Inc. (US), Advance Micro Device Inc. (US), eInfochips (US), Altium Limited (Australia), Zuken Inc. (Japan), Silvaco, Inc. (US).
The 3D IC and 2.5D IC packaging market size is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).
The Raman spectroscopy market size is expected to grow from USD 0.8 billion in 2023 to USD 1.1 billion by 2028, at a compound annual growth rate (CAGR) of 7.0 during the forecast period.The Key Players Thermo Fisher Scientific Inc. (US), Mettler Toledo (Switzerland), Agilent Technologies Inc. (US), Bruker (US), Renishaw Plc (UK), Rigaku Corporation (Japan), Oxford Instruments (UK), Endress+Hauser Group Services AG (Switzerland), HORIBA Ltd. (Japan), PerkinElmer Inc. (US), Hamamatsu Photonics K.K (Japan), Metrohm AG (Switzerland), Anton Paar GmbH (Austria), JASCO (Japan), Tornado Spectral Systems (Canada), Enhanced Spectrometry, Inc. (US), Zolix (China), Smiths Detection (UK), Ocean Insight (US), Ostec (US), TSI (US), Laser Detect System (Israel), Photon Systems, Inc. (US), B&W Tek (US), and Real Time Analyzers (US).
The non-volatile memory market is expected to grow from USD 74.6 billion in 2022 to USD 124.1 billion by 2027, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The key players SAMSUNG (South Korea), Western Digital Technologies, Inc. (US), KIOXIA Holdings Corporation (Japan), Micron Technology, Inc. (US), and SK HYNIX INC. (South Korea) among others. The other companies profiled in the report are Microchip Technology Inc. (US), ROHM CO., LTD. (Japan), Renesas Electronics Corporation (Japan), STMicroelectronics (US), Infineon Technologies AG (Germany), Nantero, Inc. (US), Crossbar Inc. (US), Everspin Technologies Inc. (US), Winbond (Taiwan), and Pure Storage, Inc. (US).
The global compound semiconductor market is expected to grow from USD 40.5 billion in 2022 to USD 55.8 billion by 2027, at a compound annual growth rate (CAGR) of 6.6% during the forecast period.The Key Players Nichia Corporation (Japan), Samsung Electronics Co., Ltd. (South Korea), ams OSRAM AG (Austria), Qorvo, Inc. (US), Skyworks Solutions, Inc. (US), Wolfspeed, Inc. (US), GaN Systems (Japan), Canon Inc. (Canada), Infineon Technologies AG (Germany), Mitsubishi Electric Corporation (Japan).
The global smart card IC market is expected to grow from USD 2.9 billion in 2022 to USD 3.9 billion by 2027, at a compound annual growth rate (CAGR) of 6.3% during the forecast period.The Key Players Infineon Technologies AG (Germany), NXP Semiconductors N.V. (Netherland), Samsung Electronics Co., Ltd. (South Korea), STMicroelectronics N.V. (Switzerland), Microchip Technology Incorporated (US), CEC Huada Electronic Design Co., Ltd. (China), Analog Devices, Inc. (US), Sony Group Corporation (Japan), Toshiba Corporation (Japan), and ON Semiconductor Corporation (US)
The thin wafer market is expected to grow from USD 11.4 billion in 2022 to USD 20.6 billion by 2027, at a compound annual growth rate (CAGR) of 12.5% during the forecast period.The Key Players Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US).
The molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027, at a compound annual growth rate (CAGR) of 22.9% during the forecast period.The key players device (MID) market and analyzes their market shares. Players profiled in this report are Molex (US), TE Connectivity (Switzerland), Amphenol Corporation (US), LPKF Laser & Electronics (Germany), and Taoglas (Dublin), Harting (Germany), Arlington Plating Company (US), MID Solutions (Germany), 2E Mechatronic (Germany), KYOCERA AVX (US) and Johnan (Japan), Teprosa(Germany), Sunway Communication(China), Axon Cable(France), S2P (France), Suzhou Cicor Technology (China), TactoTek (Finland), DuraTech (US), Tekra (US), Yomura Technologies (Taiwan), MacDermid Alpha Electronics (US), Galtronics (US), Yazaki Corporation (Japan), Chogori Technology (Japan), Suzhou Zeeteq Electronics (Japan), Toyo Connectors (Japan) and SINOPLAST (China).
The global RF tunable filter market is projected to reach USD 168 million by 2027, at a CAGR of 10.8% during the forecast period. Analog Devices, Inc. (US), Dover Corporation (US), Smiths Group plc (UK), The LGL Group, Inc. (US), EXFO Inc. (Canada), DiCon Fiberoptics, Inc. (US), Netcom, Inc. (US), RF Products Inc. (US), Telonic Berkeley Corporation (US), and Coleman Microwave Company (US) are some of the key players in the RF tunable filter market.
The global DRAM module and components market size is expected to reach USD 110.7 billion by 2027, at a CAGR of 1.2% during the forecast period. Some of the key companies operating in the DRAM module and components market are Samsung Electronics Co., Ltd. (South Korea), SK Hynix Inc. (South Korea), Micron Technology, Inc. (US), Nanya Technology Corporation (Taiwan), Winbond Electronics Corporation (Taiwan), Powerchip Technology Corporation (Taiwan), ADATA Technology Co. Ltd. (Taiwan), Ramaxel Technology (Shenzhen) Co, Ltd (China), Kingston Technology Corporation (US), SMART Modular Technologies (US), and so on.
The global ANPR system market is expected to grow from USD 3.1 billion in 2022 to USD 4.8 billion by 2027, at a compound annual growth rate (CAGR) of 9.2% during the forecast period.The major players Kapsch TrafficCom (Austria), Siemens (Germany), Conduent, Inc. (US), HikVision (China), Q-Free ASA (Norway), Genetec, Inc. (Canada), Adaptive Recognition (Hungary), Jenoptik Group (Germany), Axis Communications (Sweden), and Nedap (Netherlands).
The Microwave Devices Market is expected to grow from USD 6.7 billion in 2021 to USD 9.0 billion by 2027, at a CAGR of 5.1% during the forecast period. The key players operating in the Microwave Devices market include Thales Group (France), L3 Harris, Technologies, Inc. (US), Teledyne Technologies Incorporated (US), Qorvo, Inc. (US), and CPI International, Inc. (US).
The silicon photomultiplier market is expected to reach USD 173 million by 2026, at a CAGR of 7.6% during the forecast period. Some of the key companies operating in the market are ON Semiconductor (US), Broadcom (US), Hamamatsu Photonics (Japan), First Sensor (Germany), KETEK GmbH (Germany), AdvanSiD (Italy), Cremat (US), Excelitas Technologies (US), and so on.
The global semiconductor bonding market size is projected to reach USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% during the forecasting period. The semiconductor bonding market is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).
The Micro Server IC Market is expected to grow from USD 1.2 billion in 2021 to USD 2.2 billion by 2026, at a CAGR of 12.6% during the forecast period. Intel Corporation (US), Advanced Micro Devices, Inc. (US), Hewlett Packard Enterprise Development LP (US), Quanta Computer Inc. (Taiwan), NVIDIA Corporation (US), Ambedded Technology Co., Ltd. (Taiwan), Dell Inc. (US), Fujitsu (Japan), Marvell (US), Super Micro Computer Inc. (US), Ampere Computing LLC. (US), Bamboo (UK), christmann informationstechnik + medien GmbH & Co. KG (Germany), HIRO micro data centers (Netherlands), Huawei Technologies Co. Ltd. (China), IBM (US), Lattice Semiconductor (US), NXP Semiconductors (Netherlands), SiPearl (France), and STMicroelectronics (Switzerland) are some of the key players in the micro server IC market.
The photolithography equipment market is projected to reach USD 18.0 billion by 2025; it is expected to grow at a CAGR of 9.1% during the forecast period. The companies profiled in this report are ASML (Netherland), Canon (Japan), Nikon (Japan), NuFlare Technology (Japan), Onto Innovations (US), Veeco Instrument (US), SUSS Microtek (Germany), NXQ (US), EV Group (US).
The audio codec market is expected to reach USD 7.8 billion in 2025, at a CAGR of 5.5% during the forecasting period. Key players in the audio codec market include Cirrus Logic (US), Qualcomm (US) and Realtek Semiconductor (Taiwan). Cirrus Logic is a well-known player for providing innovative and customized audio codec solutions and products in the audio market. Strong brand name and customer base are among the key factors that resulted in the leading position of Qualcomm in the market. Apart from the strong brand name and customer base, the company has strong R&D capabilities and geographic presence. Qualcomm focuses on strategies such as product launches and product development to strengthen its product portfolio and maintain its position in the audio codec market.
The Magnetic Refrigeration Market is expected to grow from USD 4 million by 2022 to USD 165 million by 2027, at a CAGR of 105.4% during the forecast period. Ubiblue (France), Haier Smart Home Co., Ltd (China), Camfridge Ltd (UK), Astronautics Corporation of America (US), VACUUMSCHMELZE GmbH & Co. KG (Germany), BASF SE (Germany), ERAMET (France), Samsung Electronics Co., Ltd (South Korea), Toshiba Corporation (Japan), Whirlpool Corporation (US), MagnoTherm Solutions (Germany), Millipore Sigma (US), General Engineering and Research (US), KIRSCH (Germany), CCS SA (Switzerland), TCS Micropumps Ltd (UK), Kiutra (Germany) and Cemafroid (France) are among a few of the key players in the magnetic refrigeration market.
The Microprocessor and GPU Market is expected to grow from USD 103.0 billion in 2020 to USD 138.2 billion by 2025, at a CAGR of 6.1% during the forecast period. Intel (US), Samsung (South Korea), Qualcomm (US), Nvidia (US), AMD (US), MediaTek (Taiwan), Broadcom (US), Texas Instruments (US), IBM (US), and Marvell (Bermuda) are the key players in the global microprocessor and GPU market. These players are increasingly undertaking strategies such as product launches and development, expansions, partnerships, collaborations, joint-ventures, and acquisitions to increase their market share.
The Hermetic Packaging Market is expected to grow from USD 3.5 billion in 2020 to USD 4.3 billion by 2025, at a CAGR of 4.3% during the forecast period. The key players operating in the hermetic packaging market include SCHOTT (Germany), AMETEK, Inc. (US), Amkor Technology, Inc. (US), Texas Instruments Incorporated (US), Teledyne Technologies (US), Kyocera Corporation (Japan), Materion Corporation (US), Egide (France), Micross Components Inc. (US), and Legacy Technologies Inc. (US).
The 3D machine vision market was valued at USD 1.5 billion in 2020 and is projected to reach USD 2.4 billion by 2025; it is expected to grow at a CAGR of 9.4% from 2020 to 2025. The key players in the ecosystem of the 3D machine vision market profiled in this report are OMRON Corporation (Japan), Keyence Corporation (Japan), Cognex Corporation (US), Basler AG (Germany), National Instruments (US), ISRA Vision AG (Germany), TKH group (Netherlands), Stemmer Imaging (Germany), MVTec Software GmbH (Germany), and Tordivel AS (Norway). These players have adopted various growth strategies, such as product launches, acquisitions, partnerships, and agreements, to expand their presence in the global machine vision market further. Acquisitions and new product launches and developments have been the most dominating strategies adopted by major players from January 2017 to May 2020, which helped them to innovate on their product offerings, cope up with the COVID-19 outbreak and broaden their customer base.
The Embedded System Market is expected to grow from USD 86.5 billion in 2020 to USD 116.2 billion by 2025, at a CAGR of 6.1% during the forecast period. Intel (US), Renesas (Japan), STMicroelectronics (Switzerland), NXP Semiconductors (Netherlands), Texas Instruments (US), Microchip (US), Cypress Semiconductors (US), Qualcomm (US), Analog Devices (US), and Infineon Technologies (Germany) are the key players operating in the embedded system market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, joint ventures, partnerships, collaborations, mergers, and acquisitions to increase their market share.
The global RF semiconductor market is expected to reach USD 26.2 billion by 2025, at a CAGR of 8.5% during the forecasting period. Major players in the RF semiconductor industry include Qorvo (US), Skyworks (US), Qualcomm (US), Analog Devices (US), NXP Semiconductors (Netherlands), Cree (US), MACOM (US), Microchip Technology (US), Murata Manufacturing (Japan), and Texas Instruments (US).
The global IGBT market size is estimated to grow from USD 5.3 billion in 2020 to USD 6.6 billion by 2025, at a CAGR of 4.6%. On the other hand, the global thyristor market size is estimated to grow from USD 781 million in 2020 to USD 849 million by 2025; at a CAGR of 1.7% during the forecasting period. Infineon Technologies AG (Germany), Fuji Electric Co., Ltd. (Japan), ON Semiconductor (US), Mitsubishi Electric Corporation (Japan), and STMicroelectronics (Switzerland) are the key players in the IGBT & thyristor market. These players are increasingly undertaking strategies such as product launches, partnerships, collaborations, contracts, agreements, acquisitions, and expansions to increase their market share.
The Non-volatile Memory Express (NVMe) Market is expected to grow from USD 44.6 billion in 2020 to USD 163.5 billion by 2025, at a CAGR of 29.7% during the forecast period. Samsung Electronics Co., Ltd. (Samsung) (South Korea), Western Digital Corporation (Western Digital) (US), Intel Corporation (Intel) (US), Dell EMC (US), Hewlett Packard Enterprise (HPE) (US), Broadcom Inc. (Broadcom) (US), Micron Technology, Inc. (Micron Technology) (US), Cisco Systems, Inc. (Cisco) (US), Toshiba Corporation (Toshiba) (Japan), and NetApp, Inc. (NetApp) (US) are the prominent players in the NVMe market.
The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.
The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The high adoption of SLPs by leading OEMs, surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs are the major factors driving the growth of the substrate-like PCB market. AT&S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck Electronics (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); LG Innotek (South Korea) are major players in the substrate-like PCB market.
The GaN power device market was valued at USD 327.3 Million in 2016 and is expected to reach USD 1,890.2 Million by 2023, at a CAGR of 29.1% during the forecast period. The base year considered for the study is 2016 and the forecast period is between 2017 and 2023. The objective of the report is to provide a detailed analysis of the market on the basis of device type, voltage range, application, vertical, and geography. The report also provides information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the growth of the GaN power device market, along with the detailed value chain. The report also profiles the most promising players in the GaN power device market. The competitive landscape of the market presents an interesting picture of the strategies adopted by a large number of players. The key players in this industry are Cree (US), Qorvo (US), MACOM (US), Microsemi Corporation (US), Analog Devices US), Efficient Power Conversion (US), Integra Technologies (US), Transphorm (US), Navitas Semiconductor (US), Texas Instruments (US), Sumitomo Electric (Japan), Northrop Grumman Corporation (US), Qromis (US), Polyfet (US), TOSHIBA (Japan), Sumitomo Electric (Japan), Mitsubishi Electric (Japan), Panasonic (Japan), GaN Systems (Canada), VisIC Technologies (Israel), GaNPower (Canada), Infineon (Germany), Exagan (France), Ampleon (Netherlands), and EpiGaN (Belgium).
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
The overall intelligent virtual assistant (IVA) market was valued at USD 1.36 Billion in 2016 and is expected to reach USD 17.72 Billion by 2023, at a CAGR of 38.82% between 2017 and 2023. The report aims at estimating the market size and future growth potential of the IVA market based on product, user interface, type, industry, and geographic analysis. Major companies in the overall IVA market that have been included in this report are Alphabet (US), Amazon.com (US), Apple (US), Nuance Communications (US), IBM (US), Microsoft (US), Samsung Electronics (South Korea), Inbenta Technologies (US), Baidu (China), and Blackberry (US).
The universal flash storage market is valued at USD 1.65 Billion in 2016 and is estimated to grow at a CAGR of 18.3% to reach USD 4.50 Billion by 2023. This growth can be attributed to the growing demand for electronic devices with faster performance and improved responsiveness, rising adoption of high-speed data transfer technologies, and increasing demand for wearable electronics. Major players operating in the universal flash storage market include Arasan Chip Systems Inc. (US), Cadence Design Systems, Inc. (US), GDA Technologies Inc. (US), Micron Technology, Inc. (US), Phison Electronics Corporation, Inc. (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Silicon Motion Technology Corporation (US), SK Hynix, Inc. (South Korea), Synopsys, Inc. (US), and Toshiba Corporation (Japan).
The overall interactive voice response market is projected to exhibit a lucrative growth potential between 2017 and 2023. The interactive voice response (IVR) market was valued at USD 3.73 Billion in 2017 and is expected to reach USD 5.54 Billion by 2023, at a CAGR of 6.83% during the forecast period. The growth of the IVR market is attributed to the increasing integration of advanced technologies and rise in the cloud-based services that meet the industry standards for the IVR systems. The key market players in the North America are inContact Inc. (US), Nuance Communications, Inc. (US), Convergys Corporation (US), Avaya Inc. (US), Cisco Systems, Inc. (US), AT&T Inc. (US), West Corporation (US), Genesys Telecommunication Laboratories, Inc. (US), Verizon Communications Inc. (US), and 24/7 Customer, Inc. (US).
The Bluetooth Smart and Smart Ready market was valued at USD 4.55 Billion in 2016 and is expected to reach USD 5.34 Billion by 2023, at a CAGR of 2.23% during the forecast period. Growth of this market is being fueled by technological advancements over the past few years. Some of the major companies operating in the Bluetooth Smart and Smart Ready market are Qualcomm Inc. (US), Broadcom Corporation (Singapore), Cypress Semiconductor Corporation (US), Dialog Semiconductor PLC (UK), Marvell Technology Group, Ltd. (Bermuda), Mediatek, Inc. (Taiwan), Nordic Semiconductor ASA (Norway), Bluegiga Technologies (Finland), Texas Instruments Incorporated (US), Fanstel Corporation (US), Toshiba Corporation (Japan), Murata Manufacturing Co., Ltd. (Japan), Renesas Electronics Corporation (Japan), Microchip Technology Inc. (US), and CEVA, Inc. (US).
The sensor hub market was valued at USD 9.87 Billion in 2016 and is expected to reach USD 32.53 Billion by 2023, at a CAGR of 18.9% during the forecast period. The sensor hub market is driven by factors such as the steady growth in the number of integrated sensors in smartphones and the increasing use of 6-axis and 9-axis sensor solutions or use of sensor fusion within devices. Major players involved in the sensor hub market include Microchip Technology, Inc.(US), STMicroelectronics N.V. (Switzerland), Robert Bosch GmbH (Germany), NXP Semiconductors N.V.(Netherland), RoHM Co. Ltd. (Japan), Analog Devices, Inc.(US), InvenSense, Inc. (US), Intel Corp (US), Infineon Technologies AG (Germany), RoHM Co. Ltd. (Japan) and Memsic, Inc. (US).
The stretchable conductive material market was valued at USD 0.1 Million in 2015 and is expected to reach USD 6.5 Million by 2022, growing at a CAGR of 79.10% during the forecast period. The increasing use of stretchable conductors in consumer electronics and advancements in design strategies, assembly techniques, and materials and the higher operational speed through the miniaturization of electronic products are the major drivers for the stretchable conductive material market.
The ballast water treatment (BWT) market was valued at USD 14.29 Billion in 2016 and is expected to reach USD 118.77 Billion by 2022, at a CAGR of 37.19% during the forecast period. The growth of this market is propelled by the increasing government rules and regulations for the installation of BWT systems in the ships.